Win Enterprises announced one of the first Mini-ITX SBCs with AMD’s latest “Steppe Eagle” G-Series SoCs, featuring TDPs down to 6 Watts.
Shortly after AMD announced its original line-up of five Embedded G-Series SoC in May 2013, Win Enterprises was one of the first to jump out with a product, unveiling its 3.5-inch MB-60830 single board computer. Now it’s one of the first embedded vendors to integrate the six new “Steppe Eagle” G-Series SoC models announced by AMD in June of this year, this time in a Mini-ITX motherboard called the MB-73360.
The MB-73360 supports applications including gaming, factory floor control and automation, kiosk, POS/retail, medical, and security, says Win Enterprises. No OS support was listed, but like all G-Series SoCs, the Steppe Eagle versions run Linux as well as Windows.
As before, the Steppe Eagle G-Series SoCs include both dual- and quad-core configurations. AMD also announced some 64-bit “Crowned Eagle” SoCs, which lack GPUs, but these do not appear to be supported on the MB-73360. The four new Steppe Eagle models feature up to a 60 percent jump in CPU performance and up to 53 percent more overall performance compared to earlier models, claims AMD. They are also claimed to offer up to a 96 percent improvement in overall performance-per-Watt. Other new features are said to include ECC memory support and a dedicated Platform Security Processor (PSP) compatible with ARM TrustZone technology.
Full list of G-Series SoC models including new Steppe Eagle models
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Win Enterprises gives you a choice of three G-Series Steppe Eagle SoC models: the quad-core, 2.4GHz GX424CC with 25W TDP; the quad-core, 1.2GHz GX412HC with 7W TDP; and the 2GHz, dual-core GX212JC with 6W TDP. The company touts Steppe Eagle’s capability of using a configurable thermal design power feature that can lower power consumption to just 5 Watts at the processor level. Presumably, the 5W figure applies to the 6W GX212JC, with comparable reductions available for the other two models.
MB-73360 feature and port details
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The MB-73360 supports up to 8GB or 16GB of DDR3 RAM, depending on whether you consult the product page spec list or the attached data sheet. Only the product page chart lists ECC support. Otherwise, both sources agree on the rest of the lineup, which includes dual HDMI ports and a VGA port. No mention was made of dual display support.
The MB-73360 is further equipped with two PCI-Express and one mini-PCIe slot, dual gigabit Ethernet ports, and nine USB ports, including a pair of 2.0 and 3.0 ports each available on the coastline. Other coastline ports include audio ports and two out of the seven serial ports. A pair of SATA connectors is also available. The board supports a wide-range input of DC 8V to 32V.
Summary of MB-73360 specs
Specifications listed for the MB-73360 Mini-ITX board include:
- Processor — AMD Embedded G-Series (Steppe Eagle) SoC:
- GX424CC (OPN code GE424) — 4x Steppe Eagle cores @ 2.4GHz with 25W TDP, 2MB cache, 497MHz Radeon HD 8400E graphics
- GX412HC (OPN code GE412) — 4x Steppe Eagle cores @ 1.2GHz with 7W TDP, 2MB cache, 300MHz Radeon HD 8400E graphics
- GX212JC (OPN code GE212) — 2x Steppe Eagle cores @ 1.2GHz with 6W TDP, 1MB cache, 300MHz Radeon HD 8400E graphics
- Memory — 2x SODIMM sockets for up to 8GB or 16GB DDR3 RAM (1866MHz for GX424CC, 1333MHz for others)
- Storage — 2x SATA (6.0Gb/s)
- Networking — 2x gigabit Ethernet ports (RJ-45)
- Display — 2x HDMI ports for up to 4K resolution; VGA port
- Audio — mic-in, line-in, line-out
- USB ports:
- 7x USB 2.0 ports (2x coastline; 5x on headers)
- 2x USB 3.0 ports
- Other I/O:
- Serial — 6x RS-232 (2x coastline, 4x on headers)
- 1x LPC header for optional TPM
- 8x Digital I/O lanes
- PCIe x16 slot
- PCIe x1 slot
- Mini-PCIe slot
- Operating temperature — 0 – 60°C
- Power — DC 8V to 32V input
- Dimensions — 6.7 x 6.7 inches (170 x 170mm); Mini-ITX form-factor
Win Enterprises did not provide pricing or delivery information. Further details are available at the company’s MB-73360 product page .