Adlink unveiled a ruggedized “LEC-BT” full-sized SMARC module based on the Atom E3800, featuring a camera interface and industrial temperature support.
The SMARC computer-on-module form-factor was originally intended as an ARM vehicle, but in March Kontron announced the “world’s first x86-based SMARC COM” with its Intel Atom E3800 based SMARC-sXBTi COM. Now Adlink has countered with its own similarly Linux- and Android-ready Atom E3800 SMARC module.
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The LEC-BT is a full-size SMARC module, at 82 x 80mm, whereas Kontron’s SMARC-sXBTi is the “short” form-factor, at 80 x 50mm. The Adlink model supports only half the RAM of the Kontron SMARC COM, but adds a camera interface and additional GPIO and serial interfaces. Like the Kontron COM, the LEC-BT offers an industrial temperature model, although it also offers a commercial version, and it adds MIL-STD-202F shock and vibration resistance.
Otherwise, the modules are quite similar, as is often the case when two COMs use the same processor and form-factor. You get a choice of single-, dual-, and quad-core Atoms, ranging from 5W to 10W TDP. In addition to being able to load up to 4GB of DDR3 RAM on the module, you can choose to equip it with a 2GB to 64GB bootable, soldered eMMC flash drive. Like the rest of the I/O, SATA and SDIO signals are available to the carrier board via the SMARC-standard 314-pin MXM3 connector
LEC-BT block diagram
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The LEC-BT offers HDMI, LVDS, and gigabit Ethernet connections, as well as support for a USB 3.0 port and three USB 2.0 ports. Five of the 12 GPIO lanes are dedicated to the CSI camera, and additional serial interfaces include I2S audio, SPI, and I2C.
The LEC-BT provides three PCI-Express lanes for expansion. Like most Adlink COMs, the device supports the company’s Smart Embedded Management Agent (SEMA) module for system monitoring, although it’s unclear if this is standard or optional.
Specifications listed for the LEC-BT include:
- Processor — Intel Atom E3800, with choice of:
- E3845 (4x cores @ 1.91GHz), 10W TDP
- E3826 (2x cores @ 1.46GHz), 7W TDP
- E3815 (1x cores @ 1.46GHz), 5W TDP
- Up to 4GB DDR3L-1066/1333 (1.35V) with ECC
- 4GB to 64GB optional bootable, soldered eMMC
- SDIO interface
- SATA 3Gbps interface
- HDMI 1.4a (from DDI1)
- LVDS (single-channel 18/24-bit) from DDI0
- CSI 4L/1L (camera)
- Networking — Gigabit Ethernet
- Other I/O:
- USB 3.0
- 3x USB 2.0
- 2x SPI
- 2x I2C
- I2S (Intel HD Audio)
- 2x UARTs
- 12x GPIO (5x dedicated to camera)
- Expansion bus — 3x PCIe x1 Gen 2
- Other features — SEMA board controller (watchdog; hardware monitoring, fan, etc.)
- Carrier board interface — 314-pin MXM3 connector
- Power — 3 to 5.25 VDC; 5 to 10W consumption; power management interface
- Operating temperature — 0 to 60°C or -40 to 85°C
- Shock/vibration resistance — IEC 60068-2-64 and IEC-60068-2-27; MIL-STD-202F, Method 213B, Table 213-I, Condition A, and Method 214A, Table 214-I, Condition D
- HALT — Thermal and vibration stress, thermal shock, and combined
- Dimensions — 82 x 80mm; SMARC full size
- Operating system — Linux; VxWorks; Windows 7/8, WEC7; extended support for Android and QNX