Board Technical Specifications Comparison

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Aaeon UP Core vs. Hardkernel ODROID-HC2 vs. DFI KU553 vs. NetCube Systems Austria Kumquat vs. FriendlyElec NanoPi R1S-H3

	× UP Core	× ODROID-HC2	× KU553	× Kumquat	× NanoPi R1S-H3
Manufacturer	Aaeon	Hardkernel	DFI	NetCube Systems Austria	FriendlyElec
Price	$ 169.0	$ 54.0	-	$ 137.99	$ 20.0
SoC	Intel Atom x5-Z8350 Cherry Trail	Samsung Exynos 5422	Intel 7th Generation Core Processors	AllWinner V3s	Allwinner H3
CPU	4× Intel x86_64 @ 1.92 Ghz	4× ARM Cortex-A15 @ 2.0 Ghz 4× ARM Cortex-A7 @ 1.4 Ghz	4× x86 @ 2.8 Ghz	1× ARM Cortex-A7 @ 1.2 Ghz	4× ARM Cortex-A7 @ 1.3 Ghz
GPU	Intel HD 400 Graphics	Mali-T628 MP6	-	-	Mali400 MP2
Onboard MCU	-	-	-	1 x ESP32 Xtensa LX6 dual-core (WiFi / Bluetooth)	-
RAM	4.0 GiB DDR3	2.0 GiB DDR3L	16.0 GiB DDR4	64.0 MiB DDR2 @ 400MHz	1.0 GiB DDR3
SPI flash	-	-	-	8.0 MiB, bootable	-
eMMC	1 × soldered	1 × soldered	-	-	1 × soldered
USB	3 × host ports	1 × host port	6 × host ports	1 of which are Type-C 1 of which support USB-OTG	1 × host port
Ethernet		1× 1 Gbps	1× 1 Gbps	1× 10/100	1× 1 Gbps
Wi-Fi	On-board Wi-Fi without external antenna 2.4Ghz b/g/n	-	-	On-board Wi-Fi without external antenna 2.4Ghz b/g/n	On-board Wi-Fi with external antenna 2.4Ghz b/g/n
Bluetooth	onboard	-	-	onboard	-
Camera	up to 2 x inputs	-	-	-	-
Audio	1 × I2S	-	1 × outputs 1 × mic-in	1 × outputs 1 × mic-in	-
GPIO	110	-	8	12	-
PWM	2	-	-	-	-
I2C	2	-	-	1	-
SPI	2	-	1	-	-
UART	1	1	-	1	-
CAN	-	-	-	1	-
Form factor	-	-	-	DIN rail	-
Dimensions	66 mm x 57 mm x 10 mm	197 mm x 115 mm x 42 mm	146 mm x 102 mm	106 mm x 82 mm x 45 mm	55 mm x 52 mm
Temperature	0.0°C - 60.0°C	-	0.0°C - 60.0°C	-20.0°C - 70.0°C	-20.0°C - 70.0°C
Software	Linux: True (mainline) Android: 6.0 Windows: 10	Linux: True	Linux: True (mainline) Windows: 10 IoT Enterprise	Linux: True	Linux: True