Board Technical Specifications Comparison
Add boards using the dropdown below, and compare their specs side by side.
Boardcon EMH6 SBC vs. Intrinsyc Open-Q 835 vs. FS Elektronik Systeme PicoCoreMX6SX
EMH6 SBC |
Open-Q 835 |
PicoCoreMX6SX |
|
| Manufacturer | Boardcon | Intrinsyc | FS Elektronik Systeme |
| Price | - | $ 270.0 | - |
| SoC | Allwinner H6 | Qualcomm Snapdragon 835 | NXP i.MX 6SoloX |
| CPU | 4× ARM Cortex-A53 @ 1.8 Ghz | 8× Qualcomm Kryo 280 @ 2.2 Ghz | 1× ARM Cortex-A9 @ 800 Mhz |
| GPU | Mali T-720 | Qualcomm Adreno 540 | 3D, 2D |
| RAM | 1.0 GiB DDR3L | 4.0 GiB LPDDR4 | 1.0 GiB DDR3L |
| eMMC | 1 × soldered | 1 × soldered | 1 × soldered |
| USB |
2 × host ports 1 of which support USB-OTG |
1 × host port 1 of which support USB-OTG |
1 × host port 1 of which support USB-OTG |
| Ethernet |
1× 10/100
|
1× 1 Gbps
|
|
| Wi-Fi |
On-board Wi-Fi without external antenna 2.4Ghz b/g/n |
On-board Wi-Fi without external antenna 2.4Ghz b/g/n 5Ghz a/n/ac |
- |
| Bluetooth | onboard | onboard | - |
| Camera | - | up to 3 x inputs | - |
| Audio |
1 × outputs 1 × line-in 1 × mic-in 1 × spdif-out |
- |
1 × outputs 1 × line-in 1 × mic-in 1 × spdif-out 1 × I2S |
| GPIO | 6 | 1 | - |
| PWM | - | - | 8 |
| I2C | - | 1 | 3 |
| SPI | - | 1 | 2 |
| UART | 1 | 1 | 5 |
| CAN | - | - | 2 |
| Dimensions | 140 mm x 100 mm | 50 mm x 25 mm x 5 mm | 35 mm x 40 mm |
| Temperature | - | -10.0°C - 70.0°C | 0.0°C - 70.0°C |
| Software |
Linux: True Android: 7.1 |
Linux: True Android: 8 |
Linux: True Windows: WEC 2013 |