Board Technical Specifications Comparison

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DFI AL253 vs. Hardkernel Odroid-N1 vs. Technologic Systems TS-4100 vs. FriendlyElec SOM-RK3399 vs. Forlinx S5P4418 SBC

	× AL253	× Odroid-N1	× TS-4100	× SOM-RK3399	× S5P4418 SBC
Manufacturer	DFI	Hardkernel	Technologic Systems	FriendlyElec	Forlinx
SoC	Intel Atom Processor E3900 Series	Rockchip RK3399	NXP i.MX 6UltraLite	Rockchip RK3399	Samsung S5P4418
CPU	4× x86 @ 1.6 Ghz	2× ARM Cortex-A72 @ 2.0 Ghz 4× ARM Cortex-A53 @ 1.5 Ghz	1× ARM Cortex-A7 @ 700 Mhz	2× ARM Cortex-A72 @ 2.0 Ghz 4× ARM Cortex-A53 @ 1.5 Ghz	4× ARM Cortex-A9 @ 1.43 Ghz
GPU	-	Mali-T860 MP4	pxp	Mali-T860 MP4	-
RAM	8.0 GiB DDR3L	4.0 GiB DDR3	1.0 GiB DDR3	2.0 GiB DDR3	1.0 GiB
eMMC	1 × soldered	1 × soldered	1 × soldered	1 × soldered	1 × soldered
USB	6 × host ports	4 × host ports	2 × host ports 2 of which support USB-OTG	3 × host ports 1 of which support USB-OTG	2 × host ports 1 of which support USB-OTG
Ethernet	1× 1 Gbps	1× 1 Gbps	1× 10/100	1× 1 Gbps	1× 10/100
Wi-Fi	-	-	On-board Wi-Fi with external antenna 2.4Ghz b/g/n 5Ghz a/n	-	On-board Wi-Fi without external antenna 2.4Ghz b/g/n
Bluetooth	-	-	onboard	-	onboard
Camera	-	-	up to 1 x inputs	up to 2 x inputs	up to 1 x inputs
Audio	1 × outputs 1 × mic-in	-	1 × outputs 1 × I2S	1 × spdif-out 1 × I2S	1 × outputs 1 × mic-in
GPIO	8	40	46	14	-
PWM	-	1	8	2	4
ADC	-	2	-	3	7
I2C	-	2	1	4	3
SPI	1	1	1	1	3
UART	-	1	-	1	6
CAN	-	-	2	-	-
Dimensions	165 mm x 115 mm	90 mm x 90 mm x 20 mm	75 mm x 55 mm	70 mm x 50 mm	130 mm x 190 mm
Temperature	-40.0°C - 70.0°C	-	-40.0°C - 85.0°C	-20.0°C - 65.0°C	0.0°C - 70.0°C
Software	Linux: True (mainline) Windows: 10 IoT Enterprise, 7, WES7	Linux: True Android: 7.1	Linux: True	Linux: True Android: 7.1, 8.1	Linux: True Android: 5.1