Board Technical Specifications Comparison
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DFI GH551 vs. SECO UDOO Dual Basic vs. Forlinx i.MX6Q SBC
GH551 |
UDOO Dual Basic |
i.MX6Q SBC |
|
| Manufacturer | DFI | SECO | Forlinx |
| Price | - | $ 99.0 | - |
| SoC | AMD AMD’s Ryzen Embedded SoCs | NXP i.MX 6 | NXP i.MX6Quad |
| CPU | 4× x86 @ 2.6 Ghz | 2× ARM Cortex-A9 @ 1.0 Ghz | 4× ARM Cortex-A9 @ 1.0 Ghz |
| GPU | - | Vivante GC 880 + Vivante GC 320 | Vivante GC355 |
| RAM | 16.0 GiB DDR4 | 1.0 GiB | 1.0 GiB DDR3 |
| eMMC | - | 1 × soldered | 1 × soldered |
| USB | 3 × host ports |
2 × host ports 2 of which support USB-OTG |
1 × host port 1 of which support USB-OTG |
| Ethernet |
1× 1 Gbps
|
1× 1 Gbps
|
|
| Wi-Fi | - | - |
On-board Wi-Fi with external antenna 2.4Ghz b/g/n |
| Bluetooth | - | - | onboard |
| Camera | - | - | up to 1 x inputs |
| Audio | - |
1 × outputs 1 × mic-in |
1 × outputs 1 × mic-in 1 × I2S |
| GPIO | 8 | 76 | 220 |
| PWM | - | - | 1 |
| ADC | - | 12 | 5 |
| I2C | - | - | 3 |
| SPI | 1 | - | 2 |
| UART | - | - | 5 |
| CAN | - | - | 2 |
| Pin header | - | Shield (Arduino) | - |
| Dimensions | 146 mm x 102 mm | - | 60 mm x 60 mm x 4 mm |
| Temperature | -30.0°C - 80.0°C | - | -40.0°C - 85.0°C |
| Software |
Linux: True (mainline) Windows: 10 IoT Enterprise |
Linux: True Android: 4.4 |
Linux: True Android: 4.4, 6.0 |