Board Technical Specifications Comparison

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Forlinx FET335xS-II SoM vs. DFI AL051 vs. MYIR Tech MYC-YA157C CPU Module vs. Hardkernel Odroid-H2-plus


FET335xS-II SoM

AL051

MYC-YA157C CPU Module

Odroid-H2-plus
Manufacturer Forlinx DFI MYIR Tech Hardkernel
Price $ 45.0 - $ 29.0 $ 119.0
SoC TI Sitara AM3354 Intel Atom E3900 Series STMicroelectronics STM32MP157 Intel Celeron J4115
CPU 1× ARM Cortex-A8 @ 800 Mhz 4× x86 @ 1.6 Ghz 2× ARM Cortex-A7 @ 650 Mhz 4× Intel Gemini Lake @ 2.5 Ghz
GPU PowerVR SGX530 - 3D Intel UHD Graphics 600
RAM - 8.0 GiB DDR3L 1.0 GiB DDR3
eMMC 1 × soldered - 1 × soldered 1 × soldered
USB 1 × host port
1 of which support USB-OTG
4 × host ports 1 × host port
1 of which support USB-OTG
4 × host ports
Ethernet
1× 1 Gbps
1× 1 Gbps
1× 1 Gbps
1× 2.5 Gbps
Camera - - up to 1 x inputs -
Audio
1 × I2S
1 × outputs
1 × mic-in
1 × outputs 1 × outputs
1 × line-in
1 × spdif-out
GPIO 70 8 97 -
PWM 3 - - -
ADC 7 - 1 -
I2C 3 - 6 2
SPI 2 - 6 -
UART 6 - 8 2
CAN 2 - 2 -
Form factor - Pico-ITX - -
Dimensions 52 mm x 42 mm x 3 mm 100 mm x 72 mm 45 mm x 43 mm 110 mm x 47 mm x 110 mm
Temperature -40.0°C - 85.0°C 0.0°C - 60.0°C 0.0°C - 70.0°C 0.0°C - 70.0°C
Software Linux: True
Windows: CE 6.0
Linux: True (mainline)
Windows: 10 IoT Enterprise
Linux: True Linux: True (mainline)
Windows: Windows (x86_64)