Board Technical Specifications Comparison

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Hardkernel Odroid U3 vs. DFI BW551 vs. TechNexion EDM1-CF-IMX6SX vs. DFI WL051 vs. Raspberry Pi Foundation Raspberry Pi Compute Module 3+

	× Odroid U3	× BW551	× EDM1-CF-IMX6SX	× WL051	× Raspberry Pi Compute Module 3+
Manufacturer	Hardkernel	DFI	TechNexion	DFI	Raspberry Pi Foundation
Price	$ 69.0	-	-	-	$ 31.0
SoC	Samsung Exynos4412 Prime	Intel Pentium/Celeron Processor N3000 Family	NXP i.MX 6SoloX	Intel 8th Generation Core Processors	Broadcom BCM2837B0
CPU	4× ARM Cortex-A9 @ 1.7 Ghz	4× x86 @ 1.6 Ghz	1× ARM Cortex-A9 @ 1.0 Ghz	4× x86 @ 2.2 Ghz	4× ARM Cortex-A53 @ 1.2 Ghz
GPU	Mali-400 Quad Core	-	Vivante GC400T	Intel UHD Graphics 620/610	VideoCore IV
Embedded MCU	-	-	1 x ARM Cortex-M4	-	-
RAM	2.0 GiB	8.0 GiB DDR3L	2.0 GiB DDR3	32.0 GiB DDR4	1.0 GiB
eMMC	1 × soldered	-	1 × soldered	-	1 × soldered
USB	3 × host ports 1 of which support USB-OTG	6 × host ports	1 × host port 1 of which support USB-OTG	4 × host ports	1 × host port 1 of which support USB-OTG
Ethernet	1× 10/100	1× 1 Gbps	1× 1 Gbps	1× 1 Gbps
Wi-Fi	-	-	On-board Wi-Fi without external antenna 2.4Ghz b/g/n	-	-
Bluetooth	-	-	onboard	-	-
Camera	-	-	-	-	up to 2 x inputs
Audio	1 × outputs	1 × outputs 1 × mic-in	1 × outputs	1 × outputs 1 × mic-in	2 × I2S
GPIO	-	8	8	8	48
PWM	-	-	-	-	2
ADC	-	-	1	-	-
I2C	1	-	-	1	2
SPI	1	1	-	1	2
UART	1	-	-	-	2
CAN	-	-	2	-	-
Pin header	-	-	-	-	HAT (Raspberry Pi)
Form factor	-	-	-	Pico-ITX	Raspberry Pi Compute Module 3
Dimensions	83 mm x 48 mm x 17 mm	146 mm x 102 mm	82 mm x 60 mm x 3 mm	100 mm x 72 mm	68 mm x 31 mm x 4 mm
Temperature	0.0°C - 75.0°C	0.0°C - 60.0°C	-	-30.0°C - 80.0°C	-25.0°C - 80.0°C
Software	Linux: True Android: 4.4	Linux: True (mainline) Windows: 7, WES7, 8.1, 10 IoT Enterprise	Linux: True Windows: Embedded Compact 7	Linux: True (mainline) Windows: 10 IoT Enterprise	Linux: True (mainline)