Board Technical Specifications Comparison
Add boards using the dropdown below, and compare their specs side by side.
HiSilicon HiKey 970 vs. Firefly Core-3399Pro-JD4
HiKey 970 |
Core-3399Pro-JD4 |
|
| Manufacturer | HiSilicon | Firefly |
| Price | $ 300.0 | $ 119.0 |
| SoC | Huawei HiSilicon Kirin 970 | Rockchip RK3399Pro |
| CPU |
4× ARM Cortex-A73 @ 2.36 Ghz 4× ARM Cortex-A53 @ 2.36 Ghz |
2× ARM Cortex-A72 @ 1.8 Ghz 4× ARM Cortex-A53 @ 1.4 Ghz |
| GPU | Mali G72-MP12 | ARM Mali-T860 MP4 |
| RAM | 6.0 GiB LPDDR4 | 6.0 GiB DDR3L |
| eMMC | 1 × soldered | 1 × soldered |
| USB |
3 × host ports 1 of which are Type-C 2 of which support USB-OTG |
2 × host ports 1 of which are Type-C 1 of which support USB-OTG |
| Ethernet |
1× 1 Gbps
|
1× 1 Gbps
|
| Wi-Fi |
On-board Wi-Fi without external antenna 2.4Ghz b/g/n 5Ghz a/n/ac |
- |
| Bluetooth | onboard | - |
| Modem | onboard | - |
| Camera | up to 2 x inputs | up to 2 x inputs |
| Audio |
1 × I2S |
1 × outputs 1 × line-in 1 × mic-in 1 × spdif-out 1 × I2S |
| GPIO | 100 | - |
| PWM | - | 3 |
| ADC | - | 4 |
| I2C | 2 | 9 |
| SPI | 1 | 5 |
| UART | 2 | 5 |
| CAN | 1 | - |
| Form factor | 96boards CE Extended | - |
| Dimensions | 100 mm x 85 mm x 10 mm | 85 mm x 70 mm |
| Temperature | 0.0°C - 70.0°C | - |
| Software |
Linux: True Android: 8.1 |
Linux: True Android: Android |