Board Technical Specifications Comparison

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i2SOM PanGu Board vs. Litemax AECX-TGL0 vs. Hardkernel ODROID-HC2 vs. FriendlyElec NanoPi NEO AIR vs. ADL Embedded Solutions ADLE3900HDC


PanGu Board

AECX-TGL0

ODROID-HC2

NanoPi NEO AIR

ADLE3900HDC
Manufacturer i2SOM Litemax Hardkernel FriendlyElec ADL Embedded Solutions
Price $ 47.0 - $ 54.0 $ 18.0 -
SoC STMicroelectronics STM32MP157 Intel Tiger Lake-UP3 Samsung Exynos 5422 AllWinner H3 Intel Atom E39xx
CPU 2× ARM Cortex-A7 @ 650 Mhz 4× x86 11th Gen Core @ 2.2 Ghz 4× ARM Cortex-A15 @ 2.0 Ghz
4× ARM Cortex-A7 @ 1.4 Ghz
4× ARM Cortex-A7 @ 1.2 Ghz 4× x86 @ 2.0 Ghz
GPU Vivante (3D GPU; supports OpenGL ES2.0) HD Gen 12-H, LP-HD Graphics Mali-T628 MP6 Mali-400 MP2 Intel HD Graphics 505
RAM 1.0 GiB DDR3L 2.0 GiB DDR3L 1.0 GiB DDR3 8.0 GiB LPDDR4
eMMC 1 × soldered - 1 × soldered 1 × soldered 1 × soldered
USB 3 × host ports
1 of which support USB-OTG
8 × host ports 1 × host port 2 × host ports
1 of which support USB-OTG
8 × host ports
Ethernet
1× 1 Gbps
1× 1 Gbps
1× 1 Gbps
1× 1 Gbps
Wi-Fi - - - On-board Wi-Fi with external antenna
2.4Ghz b/g/n
-
Bluetooth - - - onboard -
Camera up to 1 x inputs - - up to 1 x inputs -
Audio 1 × outputs
1 × line-in
1 × outputs
1 × line-in
1 × mic-in
- 1 × outputs
1 × mic-in
1 × spdif-out
1 × I2S
-
GPIO 1 8 - 36 8
PWM 1 - - 1 -
ADC 1 - - - -
I2C 1 - - 1 -
SPI 1 1 - 1 -
UART 1 - 1 2 -
CAN 1 - - - -
Dimensions 106 mm x 70 mm x 7 mm 146 mm x 102 mm 197 mm x 115 mm x 42 mm 40 mm x 40 mm x 5 mm 147 mm x 102 mm
Temperature 0.0°C - 70.0°C 0.0°C - 60.0°C - - -20.0°C - 70.0°C
Software Linux: True Linux: True (mainline)
Windows: 10
Linux: True Linux: True Linux: True (mainline)
Windows: yes