Board Technical Specifications Comparison
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Intrinsyc Open-Q 845 uSoM vs. Forlinx OKMX6Q-C SBC
Open-Q 845 uSoM |
OKMX6Q-C SBC |
|
| Manufacturer | Intrinsyc | Forlinx |
| SoC | Qualcomm Snapdragon SDA845 | NXP i.MX6Quad |
| CPU |
4× Qualcomm Kryo 385 Gold @ 2.65 Ghz 4× Qualcomm Kryo 385 Silver @ 1.766 Ghz |
4× ARM Cortex-A9 @ 1.0 Ghz |
| GPU | Qualcomm Adreno 630 | Vivante GC355 / Vivante GC320 |
| RAM | 6.0 GiB LPDDR4 | 1.0 GiB |
| eMMC | - | 1 × soldered |
| USB |
2 × host ports 1 of which support USB-OTG |
2 × host ports 1 of which support USB-OTG |
| Ethernet |
1× 1 Gbps
|
|
| Wi-Fi |
On-board Wi-Fi without external antenna 2.4Ghz b/g/n 5Ghz a/n/ac |
On-board Wi-Fi without external antenna 2.4Ghz b/g/n |
| Bluetooth | onboard | - |
| Camera | up to 4 x inputs | up to 1 x inputs |
| Audio | - |
1 × outputs 1 × mic-in 1 × I2S |
| GPIO | 1 | 19 |
| PWM | - | 4 |
| I2C | 1 | 3 |
| SPI | 1 | 3 |
| UART | 1 | 5 |
| Dimensions | 50 mm x 25 mm | 130 mm x 190 mm |
| Temperature | -25.0°C - 70.0°C | 0.0°C - 70.0°C |
| Software |
Linux: True Android: 9 |
Linux: True Android: 4.2 |