Board Technical Specifications Comparison

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Lantronix Open-Q 610 microSOM vs. MYIR Tech Z-turn board vs. Embedian SMARC-FiMX6 vs. Aaeon UP Core Plus vs. Congatec conga-PA7

	× Open-Q 610 microSOM	× Z-turn board	× SMARC-FiMX6	× UP Core Plus	× conga-PA7
Manufacturer	Lantronix	MYIR Tech	Embedian	Aaeon	Congatec
Price	-	$ 99.0	$ 105.0	-	-
SoC	Qualcomm QCS610	Xilinx XC7Z010/020	NXP i.MX6 Quad	Intel Atom x5-E3940 / x7-E3950 / Celeron N3350 / Pentium N4200	Intel x6000E and J Series
CPU	2× Qualcomm Kryo 460 @ 2.2 Ghz	2× ARM Cortex-A9 @ 670 Mhz	4× ARM Cortex-A9 @ 1.0 Ghz	4× Intel x86_64 Apollo Lake @ 2.5 Ghz	4× x86 @ 1.9 Ghz
GPU	Qualcomm Adreno 612	Xilinx	Vivante GC2000	Intel HD Graphics	Intel UHD Graphics (Gen-11)
RAM	2.0 GiB LPDDR4	1.0 GiB	2.0 GiB	8.0 GiB	16.0 GiB LPDDR4
eMMC	1 × soldered	1 × soldered	1 × soldered	1 × soldered	1 × soldered
USB	2 × host ports	1 × host port 1 of which support USB-OTG	3 × host ports 1 of which support USB-OTG	3 × host ports 1 of which support USB-OTG	8 × host ports
Ethernet	1× 1 Gbps	1× 1 Gbps	1× 1 Gbps		1× 1 Gbps
Wi-Fi	On-board Wi-Fi without external antenna 2.4Ghz b/g/n 5Ghz a/n/ac	On-board Wi-Fi without external antenna	-	On-board Wi-Fi without external antenna 2.4Ghz b/g/n 5Ghz a/n/ac	-
Bluetooth	onboard	-	-	onboard	-
Camera	up to 3 x inputs	-	-	-	-
Audio	1 × I2S	1 × outputs 1 × line-in	1 × outputs	1 × I2S	1 × I2S
GPIO	1	9	12	200	-
PWM	-	-	-	1	-
ADC	-	9	-	-	-
I2C	1	1	-	1	1
SPI	1	-	-	1	-
UART	1	1	-	2	-
CAN	-	-	2	-	2
Form factor	-	-	-	-	Pico-ITX
Dimensions	50 mm x 25 mm	102 mm x 63 mm x 5 mm	82 mm x 50 mm x 4 mm	90 mm x 56 mm	100 mm x 72 mm
Temperature	-	0.0°C - 70.0°C	-	-40.0°C - 85.0°C	0.0°C - 60.0°C
Software	Linux: True Android: 10	Linux: True	Linux: True	Linux: True (mainline) Android: 6.0 Windows: 10, 10 IoT	Linux: True (mainline) Android: Android Windows: 10, 10 IoT Enterprise, 10 IoT Core