Board Technical Specifications Comparison
Add boards using the dropdown below, and compare their specs side by side.
MYIR Tech MYC-JX8MX vs. Litemax AECX-TGL0 vs. Hardkernel ODROID-HC2 vs. ADL Embedded Solutions ADLE3900HDC
MYC-JX8MX |
AECX-TGL0 |
ODROID-HC2 |
ADLE3900HDC |
|
| Manufacturer | MYIR Tech | Litemax | Hardkernel | ADL Embedded Solutions |
| Price | $ 99.0 | - | $ 54.0 | - |
| SoC | NXP i.MX 8M | Intel Tiger Lake-UP3 | Samsung Exynos 5422 | Intel Atom E39xx |
| CPU | 4× ARM Cortex-A53 @ 1.3 Ghz | 4× x86 11th Gen Core @ 2.2 Ghz |
4× ARM Cortex-A15 @ 2.0 Ghz 4× ARM Cortex-A7 @ 1.4 Ghz |
4× x86 @ 2.0 Ghz |
| GPU | Vivante GC7000-Lite | HD Gen 12-H, LP-HD Graphics | Mali-T628 MP6 | Intel HD Graphics 505 |
| RAM | 1.0 GiB DDR4 | 2.0 GiB DDR3L | 8.0 GiB LPDDR4 | |
| eMMC | 1 × soldered | - | 1 × soldered | 1 × soldered |
| USB | 4 × host ports | 8 × host ports | 1 × host port | 8 × host ports |
| Ethernet |
1× 1 Gbps
|
1× 1 Gbps
|
1× 1 Gbps
|
1× 1 Gbps
|
| Camera | up to 2 x inputs | - | - | - |
| Audio | 1 × outputs |
1 × outputs 1 × line-in 1 × mic-in |
- | - |
| GPIO | 108 | 8 | - | 8 |
| I2C | 3 | - | - | - |
| SPI | 2 | 1 | - | - |
| UART | 3 | - | 1 | - |
| Dimensions | 82 mm x 52 mm | 146 mm x 102 mm | 197 mm x 115 mm x 42 mm | 147 mm x 102 mm |
| Temperature | -30.0°C - 80.0°C | 0.0°C - 60.0°C | - | -20.0°C - 70.0°C |
| Software | Linux: True |
Linux: True (mainline) Windows: 10 |
Linux: True |
Linux: True (mainline) Windows: yes |