Board Technical Specifications Comparison
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MYIR Tech MYC-YA157C CPU Module vs. SolidRun i.MX8M Mini SOM vs. Intrinsyc Open-Q 845 uSoM
MYC-YA157C CPU Module |
i.MX8M Mini SOM |
Open-Q 845 uSoM |
|
| Manufacturer | MYIR Tech | SolidRun | Intrinsyc |
| Price | $ 29.0 | - | - |
| SoC | STMicroelectronics STM32MP157 | NXP i.MX8M Mini Q | Qualcomm Snapdragon SDA845 |
| CPU | 2× ARM Cortex-A7 @ 650 Mhz | 4× ARM Cortex-A53 @ 1.8 Ghz |
4× Qualcomm Kryo 385 Gold @ 2.65 Ghz 4× Qualcomm Kryo 385 Silver @ 1.766 Ghz |
| GPU | 3D | GC NanoUltra (3D) + GC320 (2D) | Qualcomm Adreno 630 |
| RAM | 1.0 GiB DDR3 | 4.0 GiB LPDDR4 | 6.0 GiB LPDDR4 |
| eMMC | 1 × soldered | 1 × soldered | - |
| USB |
1 × host port 1 of which support USB-OTG |
2 × host ports |
2 × host ports 1 of which support USB-OTG |
| Ethernet |
1× 1 Gbps
|
1× 1 Gbps
|
|
| Wi-Fi | - | On-board Wi-Fi without external antenna |
On-board Wi-Fi without external antenna 2.4Ghz b/g/n 5Ghz a/n/ac |
| Bluetooth | - | onboard | onboard |
| Camera | up to 1 x inputs | up to 1 x inputs | up to 4 x inputs |
| Audio | 1 × outputs |
1 × spdif-out |
- |
| GPIO | 97 | 75 | 1 |
| PWM | - | 4 | - |
| ADC | 1 | - | - |
| I2C | 6 | 2 | 1 |
| SPI | 6 | 1 | 1 |
| UART | 8 | 3 | 1 |
| CAN | 2 | - | - |
| Dimensions | 45 mm x 43 mm | 47 mm x 30 mm | 50 mm x 25 mm |
| Temperature | 0.0°C - 70.0°C | 0.0°C - 70.0°C | -25.0°C - 70.0°C |
| Software | Linux: True |
Linux: True Android: yes |
Linux: True Android: 9 |