Board Technical Specifications Comparison

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MYIR Tech MYC-YA157C CPU Module vs. SolidRun i.MX8M Mini SOM vs. Intrinsyc Open-Q 845 uSoM vs. Toradex Verdin iMX8M Mini

	× MYC-YA157C CPU Module	× i.MX8M Mini SOM	× Open-Q 845 uSoM	× Verdin iMX8M Mini
Manufacturer	MYIR Tech	SolidRun	Intrinsyc	Toradex
Price	$ 29.0	-	-	$ 138.0
SoC	STMicroelectronics STM32MP157	NXP i.MX8M Mini Q	Qualcomm Snapdragon SDA845	NXP i.MX 8M Mini
CPU	2× ARM Cortex-A7 @ 650 Mhz	4× ARM Cortex-A53 @ 1.8 Ghz	4× Qualcomm Kryo 385 Gold @ 2.65 Ghz 4× Qualcomm Kryo 385 Silver @ 1.766 Ghz	4× ARM Cortex-A53 @ 1.6 Ghz
GPU	3D	GC NanoUltra (3D) + GC320 (2D)	Qualcomm Adreno 630	Vivante GCNanoUltra
RAM	1.0 GiB DDR3	4.0 GiB LPDDR4	6.0 GiB LPDDR4	2.0 GiB LPDDR4
eMMC	1 × soldered	1 × soldered	-	1 × soldered
USB	1 × host port 1 of which support USB-OTG	2 × host ports	2 × host ports 1 of which support USB-OTG	1 × host port 1 of which support USB-OTG
Ethernet	1× 1 Gbps	1× 1 Gbps		1× 1 Gbps
Wi-Fi	-	On-board Wi-Fi without external antenna	On-board Wi-Fi without external antenna 2.4Ghz b/g/n 5Ghz a/n/ac	On-board Wi-Fi without external antenna 2.4Ghz b/g/n 5Ghz a/n/ac
Bluetooth	-	onboard	onboard	onboard
Camera	up to 1 x inputs	up to 1 x inputs	up to 4 x inputs	up to 1 x inputs
Audio	1 × outputs	1 × spdif-out	-	4 × I2S
GPIO	97	75	1	84
PWM	-	4	-	4
ADC	1	-	-	4
I2C	6	2	1	3
SPI	6	1	1	2
UART	8	3	1	4
CAN	2	-	-	-
Dimensions	45 mm x 43 mm	47 mm x 30 mm	50 mm x 25 mm	70 mm x 35 mm x 6 mm
Temperature	0.0°C - 70.0°C	0.0°C - 70.0°C	-25.0°C - 70.0°C	-45.0°C - 85.0°C
Software	Linux: True	Linux: True Android: yes	Linux: True Android: 9	Linux: True Android: yes