Board Technical Specifications Comparison

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Radxa Rock Pi 4 vs. Boardcon EMH6 SBC vs. Intrinsyc Open-Q 835 vs. Merrii Technology Co., Ltd. Hummingbird H7


Rock Pi 4

EMH6 SBC

Open-Q 835

Hummingbird H7
Manufacturer Radxa Boardcon Intrinsyc Merrii Technology Co., Ltd.
Price $ 75.0 - $ 270.0 $ 90.0
SoC Rockchip RK3399 Allwinner H6 Qualcomm Snapdragon 835 AllWinner H8
CPU 2× ARM Cortex-A72 @ 2.0 Ghz
4× ARM Cortex-A53 @ 1.5 Ghz
4× ARM Cortex-A53 @ 1.8 Ghz 8× Qualcomm Kryo 280 @ 2.2 Ghz 8× ARM Cortex-A7 @ 2.0 Ghz
GPU Mali-T860 MP4 Mali T-720 Qualcomm Adreno 540 PowerVR SGX544
RAM 4.0 GiB LPDDR4 1.0 GiB DDR3L 4.0 GiB LPDDR4 1.0 GiB DDR3
eMMC 1 × soldered 1 × soldered 1 × soldered 1 × soldered
USB 4 × host ports
1 of which support USB-OTG
2 × host ports
1 of which support USB-OTG
1 × host port
1 of which support USB-OTG
2 × host ports
1 of which support USB-OTG
Ethernet
1× 1 Gbps
supports passive and active PoE
1× 10/100
1× 10/100
Wi-Fi On-board Wi-Fi without external antenna
2.4Ghz b/g/n
5Ghz a/n/ac
On-board Wi-Fi without external antenna
2.4Ghz b/g/n
On-board Wi-Fi without external antenna
2.4Ghz b/g/n
5Ghz a/n/ac
On-board Wi-Fi without external antenna
2.4Ghz b/g/n
Bluetooth onboard onboard onboard onboard
Camera up to 1 x inputs - up to 3 x inputs up to 1 x inputs
Audio 1 × outputs
1 × mic-in
1 × I2S
1 × outputs
1 × line-in
1 × mic-in
1 × spdif-out
- 1 × outputs
1 × mic-in
GPIO 40 6 1 10
PWM 2 - - -
ADC 1 - - -
I2C 2 - 1 -
SPI 1 - 1 -
UART 2 1 1 2
Pin header HAT (Raspberry Pi)
- - -
Dimensions 85 mm x 54 mm x 20 mm 140 mm x 100 mm 50 mm x 25 mm x 5 mm 111 mm x 90 mm x 15 mm
Temperature 0.0°C - 80.0°C - -10.0°C - 70.0°C -30.0°C - 70.0°C
Software Linux: True
Android: 7.1, 9.0
Linux: True
Android: 7.1
Linux: True
Android: 8
Linux: True
Android: 4.4