Board Technical Specifications Comparison
Add boards using the dropdown below, and compare their specs side by side.
Keith and Koep Myon I vs. Forlinx FET335xS-II SoM vs. SECO SBC-A62
Myon I |
FET335xS-II SoM |
SBC-A62 |
|
| Manufacturer | Keith and Koep | Forlinx | SECO |
| Price | - | $ 45.0 | - |
| SoC | Qualcomm Snapdragon 410E | TI Sitara AM3354 | NXP i.MX6 Solo, DualLite, or Quad |
| CPU | 4× ARM Cortex-A53 @ 1.2 Ghz | 1× ARM Cortex-A8 @ 800 Mhz | 4× ARM Cortex-A9 @ 1.0 Ghz |
| GPU | Qualcomm Adreno 306 | PowerVR SGX530 | Vivante |
| RAM | 8.0 GiB DDR3L | - | 1.0 GiB |
| eMMC | 1 × soldered | 1 × soldered | 1 × soldered |
| USB |
1 of which support USB-OTG |
1 × host port 1 of which support USB-OTG |
3 × host ports |
| Ethernet |
1× 1 Gbps
|
1× 1 Gbps
|
|
| Wi-Fi |
On-board Wi-Fi with external antenna 2.4Ghz b/g/n 5Ghz a/n |
- | - |
| Bluetooth | onboard | - | - |
| Camera | up to 2 x inputs | - | - |
| Audio |
3 × outputs 3 × mic-in 2 × I2S |
1 × I2S |
1 × outputs 1 × mic-in |
| GPIO | 8 | 70 | 28 |
| PWM | - | 3 | 1 |
| ADC | - | 7 | - |
| I2C | 6 | 3 | - |
| SPI | 6 | 2 | - |
| UART | 2 | 6 | - |
| CAN | - | 2 | - |
| Dimensions | 48 mm x 32 mm x 4 mm | 52 mm x 42 mm x 3 mm | 110 mm x 87 mm x 41 mm |
| Temperature | -25.0°C - 85.0°C | -40.0°C - 85.0°C | - |
| Software |
Linux: True Android: Android Windows: 10 IoT Core |
Linux: True Windows: CE 6.0 |
Linux: True Android: 6.0 |